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TiE APAC FinTech SIG Startup Pitch

May 16, 2018
02:00 PM - 05:30 PM
HKTDC SME Centre, HKCEC 1,Expo Drive,Wan Chai
Hong Kong,Hong Kong View map →

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This two-part pitch event is part of the TIE APAC Fintech SIG Event Series.

SESSION #1:  2pm - 3:30pm
Four fintech companies present their pitch folllowed by feedback from the Hong Kong panel of funders. One pitch will be selected to go through to Session #2.  

HK Pitching Teams (alphabetical):

300 Cubits
Clare AI
Covergo
PolyDigi

SESSION #2: 3:30pm - 5:30pm
The HK winner and startups shortlisted in TiE APAC Chapters including, Melbourne and Chennai will present to an international panel of funders to provide an insight into the type of startups in Fintech and available investment opportunities.

Each team will make a presentation for 6 mins followed by 3 min of Q&A by the investors on the panel.



What is TiE APAC Fintech Special Interest Group (SIG)?

TiE APAC Fintech SIG aims to create a collaborative ecosystem across the TIE APAC community to facilitate funding and growth of Fintech and related businesses with international growth ambitions and contribute to the APAC Fintech ecosystem, consistent with TiE’s mission of fostering entrepreneurship globally through mentoring, networking, education, incubating and funding.

Participating TiE chapters: Melbourne, Hong Kong & Chennai

**This event is FOC
Pre-registration required. Limited seats available.

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Organiser : TiE HK

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TiE APAC FinTech SIG Startup Pitch

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